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Latest News » All Semiconductor News » Xradia Adds 3D X-Ray Capabilities To Nanolab Technologies


Xradia Adds 3D X-Ray Capabilities To Nanolab Technologies
High-Resolution Xradia MicroXCT 3D CT Scanner Provides Insight For NanoLab' s Turn-key Semiconductor Packaging Failure Analysis Offering


CONCORD, CA, June 9, 2009 /24-7PressRelease/ -- Xradia, Inc., a developer and manufacturer of high-resolution 3D X-ray imaging systems, today announced a partnership with NanoLab Technologies Incorporated, located in San Jose, Calif. The companies will offer 3D X-ray imaging as part of a service model which enables customers in the electronics and semiconductor industry to address semiconductor packaging development and failure analysis challenges while evaluating the purchase of their own systems.

As part of the agreement, NanoLab Technologies purchased an Xradia MicroXCT-200, an industry leading platform for 3D X-ray imaging. This new class of X-ray computed tomography scanner features sub-micron pixel resolution and impressive high contrast imaging capabilities for a larger range of sample sizes and shapes. In addition, the Xradia MicroXCT-200 detectors provide superior contrast, even for low absorption materials. The system comes equipped with multiple magnification detectors for easy zoom-in during imaging. 3D X-ray capabilities eliminate the need for physical cross sectioning and delayering for many applications, which reduces analysis time and prevents method induced artifacts.

"The MicroXCT-200 is the ideal solution for semiconductor package and electronic materials imaging," said John Traub, President, NanoLab Technologies. "Giving our customers the ability to visualize fine embedded structures in 3D within the intact chip package offers insight that's not possible with typical surface analysis tools like the AFM, SEM or conventional 2D X-ray systems. The Xradia system is a critical addition to our state-of-the-art lab offering, providing our customers with solutions to their advanced packaging technology challenges such as flip chip packages, BGA, multi-chip packages and wafer level packaging solutions."

"Our partnership with NanoLab enables us to focus on our key objective of developing and commercializing leading-edge 3D X-ray imaging systems which accelerate innovation and productivity, not only in the area of semiconductor packaging, but also in life science pre-clinical research, advanced material development and microstructure modeling for oil and gas drilling feasibility analysis," added Rod Browning, CEO, Xradia. "Offering our semiconductor customers this leading edge service helps them improve the speed, efficiency and cost of bringing new products to market."

For More Information, Please Contact:
Karen Hopkins
Strategia Marketing
Phone: 408-417-0281
E-mail: karen@strategiamarketing.com

Note to Editors: MicroXCT-200 Photos and X-Ray Images Available Upon Request.

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Press Release Contact Information:

Karen Hopkins
Xradia
Marketing
5052 Commercial Circle
Concord, CA
USA 94520
Voice: 925 288 1228
Fax: 925 288 0310
Website: Visit Our Website


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