Hesse & Knipps Presents Most Flexible and Fastest Wedge Bonder for Both Ribbon and Wire Bonding
Hesse & Knipps, leading manufacturer of high-speed, fine pitch wedge bonders for the back-end semiconductor industry, is demonstrating the capabilities of the BONDJET BJ820 during Semicon West in booth 7357.

/Semiconductor News Articles/ - MEDIA, PA, June 26, 2008 - The BONDJET BJ820 is a high-speed, fully automatic wedge bonder that offers the ultimate in flexibility for both high-speed round wire and deep access ribbon and wire bonding. It handles all challenging fine pitch wire bonding applications in a single platform - including RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive - using aluminum or gold wire or ribbon. The fastest wedge bonder on the market, BONDJET BJ820 offers bond speeds up to 7 wires/second.

With axis repeatability of 1ìm at a balanced encoder resolution of 20nm, the BONDJET BJ820 provides increased process stability that enables reliable bonding of extremely small bond pads with a larger wire diameter. A highly versatile 12" x 16.1" work area can serve as two or more smaller stations for efficient handling of smaller products or substrates. Coupled with intelligent automation solutions, parallel bond stations in one work area can eliminate significant indexing time, resulting in 60% greater throughput than competing machines.

"The BONDJET BJ820 offers very high repeatability for high volume production environments and a large control work area for both wire and ribbon bonding, offering greater throughput than competitive technology," notes Joseph Bubel, President, Hesse & Knipps, Inc. "Combining its high bonding speeds, large work area and intelligent automation solutions, the wedge bonder offers the potential for the highest throughput on the market."

Other significant machine capabilities include:
• 12.5ìm to 85ìm diameter wire bonding
• Ribbon bonding from 6ìm x 35ìm to 25ìm x 250ìm
• Constant loop height and wire length
• Maintains parallel loops within mixed reference system
• Auto teach for linear applications, reducing programming time

"The BONDJET BJ820 defines the benchmark in the industry by offering the fastest wiring speed, largest work area and greatest axis accuracy among its competition," summarizes Bubel.

With a footprint of only 720 x 1250 mm, the BONDJET BJ820 can be easily integrated into existing floor plan configurations or new concepts. For more information on the BONDJET BJ820, email us at info@hesse-knipps.us or refer to our web site at:
http://www.hesse-knipps.com/index.php?myELEMENT=Bondjet+BJ820+Beschreibung .

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Jean carl
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