Boin Releases New Software Product for Flat Panel Industry
Boin GmbH, a metrology software manufacturer for the semiconductor and flat panel industry, announces the release of a new software product for the flat panel industry: PANELMAP.


/Semiconductor News Articles/ - TOMERDINGEN, GERMANY, August 10, 2007 - Similar to WAFERMAP, an award winning software package offered by Boin GmbH and used during IC production, PANELMAP can collect, edit, analyze and visualize measured physical parameters on rectangular panels. The software is used to analyze measurements of thin and thick films e.g. passivation layers or antireflective layers, transmission characteristics of color filters or complex films such as polymers. PANELMAP can import data files from various metrology tools. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.

PANELMAP allows to analyze and visualize metrology data from different automatic metrology equipment off-line and in a standardized way. This makes such metrology data files easy comparable. A module for Statistical Process Control (SPC) is implemented offering trend charts, trend lists and an advanced file browser. PANELMAP allows for a number of mathematical operations applied to metrology data files such as rotation, shifting of the grid in the X or Y direction, or mirroring the data along the X or Y axis. It is also possible to compare different sets of data by adding, subtracting or dividing entire wafer maps. Global operations such as adding or subtracting a constant or taking the 1st or 2nd derivative can be carried out.

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Press Release Contact Information:

Manuela Boin
Boin GmbH
Boin
Haldenweg 25
Tomerdingen
Germany 89160
Voice: +49 (0) 7348 928233
Fax: +49 (0) 7348 928234
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