Displaying 1 to 15 (of 166 releases)
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Ensil Technical Services Inc. Contract Awarded by United States Air Force
By: Louis Koikas, Ensil Technical Services Inc. | February 09, 2012
Ensil Technical Services Inc. contract awarded by United States Air Force.

Palomar Technologies Develops Wire-Bond-Free Direct Attach for LEDs
By: Jessica Sylvester, Palomar Technologies | February 03, 2012
Assembly Services is supporting more than 390 700µm LEDs that are attached with an Au/Sn solder to a single 50mm metal core carrier.

Frontline Announces New President and Chairman of the Board
By: Bill Johnson, Frontline Test Equipment, Inc. | February 02, 2012
Frontline Test Equipment, Inc. is pleased to announce the promotion of David Bean, former Director of Sales and Marketing, to President. David replaces Eric Kaplan, founder and former President of the company.

San Jose Electronic Assembly Company Adds New Automatic Screen Printer to its Production Line
By: Tuan Tran, Power Design Services | January 30, 2012
Power Design Services in Silicon Valley Adds New Automatic Screen Printer to its Production Line

IC Design And Embedded Software Services Company Encore Semi Reports Positive Cash Flow
By: Urban Jangren, Encore Semi | January 18, 2012
The privately owned advanced IC design and embedded software services company leverages decades-old industry relationships, experienced contributors and new marketing website

Palomar Technologies Achieves Fifth Consecutive Year-Over-Year Revenue Growth and Profitability
By: Jessica Sylvester, Palomar Technologies | January 07, 2012
"The hard work and dedication of Palomar's worldwide team and the loyal support of our customers has resulted in our fifth consecutive year of positive growth in revenue and profitability," stated Bruce Hueners, Palomar Technologies CEO.

The Process of FPGA Design Takes Giant Leap Forward With the New Stellar IP Tool from 4DSP
By: Michael Brown, 4DSP, LLC | December 17, 2011
4DSP LLC takes another giant leap forward in simplifying the process of FPGA design by releasing their new Stellar IP tool. Stellar IP is designed to automate the creation of an FPGA image by reusing proven IP cores.

CyberOptics Semiconductor to Demo Final Production Version of WaferSense Airborne Particle Sensor at Semicon Japan
By: Lindsey Dietz, CyberOptics Semiconductor | November 29, 2011
CyberOptics Semiconductors (www.cyberopticssemi.com) will demonstrate the final production version of the WaferSense Airborne Particle Sensor (APS) during Semicon Japan in booth number 5B-204.

Sibridge Technologies Strengthens Embedded Product Design Solutions Offerings
By: Ashim Goldar, Sibridge Technologies | November 12, 2011
Offers End-to-End product design for wireless, networking and streaming media domains

Palomar Technologies Announces Exhibit at Productronica 2011 and Highlights Large Work Area Hi-Rel Wire Bonder and Die Attach Systems
By: Jessica Sylvester, Palomar Technologies | November 10, 2011
Palomar Technologies to exhibit in Hall B2, Booth 315 at Productronica 2011, held in Munich, Germany on November 15-18.

Cost-effective Gas Blender from SEMI-GAS Systems Provides Precisely Blended Gases
By: Beth Smith, Simon Group, Inc. | November 05, 2011
Blend two, three, four or more gases into accurate mixture

How Inventory Software Can Save You Time and Money; Inventory Management Software That is Now Cloud Based Saves Businesses Real Time and Money Daily
By: Eric Luoma, Scout, Inc. | October 26, 2011
Scout Incorporated is proud to introduce its new Complete Warehouse Management System Kit, designed to meet the needs of small to medium sized businesses by making inventory software incredibly easy and fast.

Palomar Technologies Named TechAmerica High Tech Awards 2011 Finalist
By: Jessica Sylvester, Palomar Technologies | October 22, 2011
Palomar Technologies was selected as a finalist in the Semiconductor category for its high-accuracy wire and die attach services via fully automated component packaging systems and precision contract assembly.

FPGA Central launches their new designed website
By: FPGA Central, FPGA Central | October 09, 2011
Enhanced resources on FPGACentral.com include News Central, Learning Central and IP Central.

Palomar Technologies Discusses Pulsed Heat Eutectic Solder and Chain Wire Bonding for HB LEDs at IMAPS 2011
By: Jessica Sylvester, Palomar Technologies | October 06, 2011
Today's HB LED applications require maximum thermal transfer to achieve performance results. Precision eutectic soldering provides high-quality, low-risk performance.

Displaying 1 to 15 (of 166 releases)
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